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Orbis 释放刻蚀系统

Home > Projects > Orbi...

释放刻蚀系统，专为MEMS器件设计

Orbis释放刻蚀系统专为MEMS器件的牺牲层释放刻蚀设计。采用特殊的反应腔体设计，确保释放过程的安全性和均匀性。支持XeF2、HF蒸汽等多种刻蚀气体。

应用领域：

MEMS器件制造、微结构释放、传感器开发

核心特点

  • 专为MEMS释放刻蚀设计
  • 支持XeF2、HF蒸汽等
  • 安全可靠的释放过程
  • 优异的均匀性
  • 批次处理能力
  • 自动化工艺控制
产品信息
  • 品牌 ULVAC
  • 型号 Orbis
  • 类别 干法刻蚀
  • 领域 微纳加工、MEMS

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